Retrofit Kits are utilized to overcome obsolescence problems in SRUs, LRUs, Test Instrumentation (TI), etc. These problems include obsolete parts, obsolete circuit card assemblies, and obsolete subassemblies. The kits may utilize alternate parts implementations, alternate equivalent repackaged parts (altered items), redesigned PLDs [Xilinx, Quick Logic, Alterra, Wise (controller with embedded memory design), Zetex (analog design)], re-engineered analog components, etc. These may be quantified as simple, mid-complexity, complex, and very complex designs and equivalent kitting. These efforts usually require manufacturing, mechanical design (drawing changes, drawings, packaging), electrical design, manufacturing test support, purchasing, QA, and shipping and receiving (all required corporate departments). The engineering level of effort and the expertise of the engineer vary from experienced to very senior, with their knowledge base being narrow (digital only or digital and analog, through all levels of microwave engineering and software development, including PLD or microprocessor design). In all instances a thorough analysis and evaluation of the UUT, test instrument, or component must be made with an understanding of its function relative to system and UUT (SRU/LRU) operation. These analyses include reading technical orders, schematics, specifications, design documents, ICDs, etc.
Analog, Digital, or Microwave component replacement with equivalent non-re-engineered component. Thermal stress testing will be performed where applicable to qualify component.
Analog, Digital, or Microwave component replacement with equivalent non-re-engineered component. Thermal stress testing will be performed where applicable to qualify component.
Replace as necessary functional equivalent parts in a different form factor that utilize adapters to mount components, making them appear to be form, fit, and function equivalent.
Replace as necessary functional equivalent parts in a different form factor that utilize adapters to mount components, making them appear to be form, fit, and function equivalent.
Replace as necessary subassembly or multiple subassemblies with replacement components/subassemblies which are functionally equivalent. Interfacing may require interfacing with voltage, clocks, input-output circuits, and example memory circuits. Change orders or TOPS pages to current O&M and/or service manuals or to UUT (SRU/LRU) manuals and configuration drawings may be necessary. Verification via system test procedures ensures compliance with the original specifications and functionality of the modified UUT or test equipment component.
Replace as necessary subassembly or multiple subassemblies with replacement components/subassemblies which are functionally equivalent. Interfacing may require interfacing with voltage, clocks, input-output circuits, and example memory circuits. Change orders or TOPS pages to current O&M and/or service manuals or to UUT (SRU/LRU) manuals and configuration drawings may be necessary. Verification via system test procedures ensures compliance with the original specifications and functionality of the modified UUT or test equipment component.
Replace a subassembly or multiple subassemblies with replacement components/subassemblies which are functionally equivalent. Where necessary, change interfacing with voltage, clocks, input-output circuits, and memory circuits. Verification to system test procedures will be performed. In addition, TOPS pages will be provided.
Replace a subassembly or multiple subassemblies with replacement components/subassemblies which are functionally equivalent. Where necessary, change interfacing with voltage, clocks, input-output circuits, and memory circuits. Verification to system test procedures will be performed. In addition, TOPS pages will be provided.
Redesign of an obsolete component or subassembly/assembly as required. Modified component/subassembly/assembly will be validated to function with its I/O (power and RF), including power draw for VCXOs, amplifiers, etc. Retrofit will meet AM/PM modulation requirements and VSWR specifications, power level specifications, and current draw specifications. A final test will be performed in the unit and drawings will be updated. ECNs will be generated or TOPS pages will be added to reflect the new configuration.
Redesign of an obsolete component or subassembly/assembly as required. Modified component/subassembly/assembly will be validated to function with its I/O (power and RF), including power draw for VCXOs, amplifiers, etc. Retrofit will meet AM/PM modulation requirements and VSWR specifications, power level specifications, and current draw specifications. A final test will be performed in the unit and drawings will be updated. ECNs will be generated or TOPS pages will be added to reflect the new configuration.
These groups consist of five levels of development ranging from Complexity 1 to Complexity 5, with level 5 the most complex. Within each complexity, nine additional subcomplexity levels exist.
Example: Simple Retrofit Kit - SRU - Complexity 4.0 to 4.9