Interface Test Adapter
Interface Test Adapters
RF Instrument
RF Instrumentation
Circuit Card Assembly
Circuit Card Assemblies
Electro-Mechanical Assembly
Electro-Mechanical Assemblies
Hybrid IEEE-1505 Cable Assembly
Cable Assemblies
IEEE-1505 Connector Assembly
Connector Assemblies
Enhanced Programmable Video Generator and Analyzer
IEEE-1505 Mass Connector Assembly
IEEE-1505 Receiver and ITA
PXI/PXIe Insert
PXI/PXIe Insert

Manufacturing Process

ATTI's manufacturing process is a natural extension of our diverse ATE and TPS design and development activities. Every facet of our operation– resources, facilities, processes, tooling, and equipment– adheres to the most stringent government demands, with all procedures and in-process controls executed per military and commercial guidelines.

Our manufacturing process is comprised of six functional areas:

  • Processing of technical drawing packages
  • Development and requisition of bills of material
  • Monitoring component/assembly acquisition by material control
  • Fabrication and testing of subassemblies
  • Final assembly/system(s) integration
  • Acceptance testing, quality assurance testing, and inspection

Our diversified product line includes:

Technician in Lab
Technician in Lab
Fortus 400mc 3D printer
Fortus 400mc 3D Printer
Haas VF-2BYT vertical machining center
Haas VF-2BYT Vertical Machining Center

Manufacturing Capabilities

ATTI's manufacturing facility is geared toward the production of ATE systems and related hardware. Manufacturing and in-process quality control inspections are co-located to maximize throughput in manufacturing subassemblies and cables. Production is divided into three separate areas: subassembly production, circuit board production and final assembly. Subassembly production is our main production facility for manufacturing subassemblies and cables from pre-manufactured components and circuit boards. Our circuit board production is a separate state of the art facility with ant-static flooring and work surfaces. Our personnel are trained in the latest industry standards and guidelines, IPCs, J-STDs, ANSI/J-STD, and ASTMs provided in IPC/EIA J-STD-001E. We have the capability to solder Ball Grid Array (BGA) devices with hundreds of pins, surface mount components and through-hole components. Our BGA production utilizes specialized equipment that heats circuit boards to a pre-designed heat profile accounting for hard to solder areas, such as ground planes. Our solder in-process inspection utilizes fiber optic lighting and microscopes to inspect solder junctions. Our final assembly area for Automatic Test Equipment (ATE) is located adjacent to the ATE testing area to streamline the manufacturing process.

Manufacturing Equipment

ATTI's production department has the tooling to manufacture ATE and related hardware including; hundreds of specialty crimping tools, solder stations, heat guns, arbor presses, punches, dies, molds, machine tools, cutting tools, gauges, and other tools. We have a state of the art 3D printing facility with a Fortus 400mc 3D printer, capable of printing parts within an 14" x 10" x 10" volume. This printer is used to manufacture replacements for obsolete parts and connectors as well as specialty components. We have a full machine shop with two state-of-the-art Haas VF-2BYT vertical machining centers to reduce cost and delivery time of critical machine parts.

ATTI has test equipment to assist in the manufacture of ATE. Our production test department utilizes in-house test equipment including digital volt meters, power supplies, oscilloscopes, function generators, spectrum analyzers, and network analyzers to test the many RF components, cables and circuit boards we manufacture. We utilize DITMCO wire and cable testers to test cables and wire harnesses. We have a full calibration facility with metrology equipment traceable NIST standards.

ATTI continually upgrades our equipment and adds assets that eliminate bottlenecks and reduces costs in our production.